• k8凯发(中国)天生赢家·一触即发

    プレスリリース

    SMIC Attains Validated End-User Status from U.S. Government

    19 Oct 2007

     
    Shanghai  [2007-10-19]

    Shanghai, China, October 22, 2007- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI and SEHK: 0981.HK), one of the leading foundries in the world today, announced that U.S. export control agencies have named SMIC in their initial list of trusted customers in the "Validated End-User" program (VEU).

    Administered by the U.S. Commerce Department, VEU will facilitate U.S. exports to China by removing licensing requirements on approved dual-use equipment and materials to approved facilities in China. SMIC is one of only five companies in the world to receive VEU status.

    With a track record of transparent commercial use of U.S.-controlled technology, SMIC now can receive and use approved U.S. equipment and materials without the delays and costs associated with traditional export licensing. Moreover, unlike traditional licensing, this VEU authorization applies across sites (to all facilities included in SMIC's VEU application, including Cension in Chengdu), extends to all technology nodes included in SMIC's VEU application, and has no expiration date.

    Matthew Szymanski, Vice President for Corporate Relations and Manager of Export Compliance for SMIC, said, "SMIC is happy to be among the first trusted customers in this program. VEU will further enhance our ability to buy leading edge equipment and supplies from the U.S., and advance our technological capabilities. VEU should assist our long-term planning because it removes licensing uncertainties for all facilities that we own or operate, currently including Cension in Chengdu and, we anticipate, WXIC in Wuhan (when it is mature enough to qualify). In the big picture, the VEU program should simplify the sale of U.S. equipment and supplies to China, contributing toward more balanced U.S.-China trade."


    About SMIC
    Semiconductor Manufacturing International Corporation ("SMIC" ; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) manufacturing service at 0.35um to 90nm and finer line technologies. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) under pilot production and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and an in-house assembly and testing facility in Chengdu. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab under construction in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation. For more information, please visit http://www.3dsentson.com

    SMIC Press Contact:

    Reiko Chang
    Corporate Relations
    +86 21 5080 2000 ext 10544
    E-mail: PR@3dsentson.com

    *Information on VEU is available from the following web sites:

    http://www.access.gpo.gov/bis/ear/pdf/748.pdf

    http://www.bis.doc.gov/usChinaExportRule.htm

    Safe Harbor Statements
    (Under the U.S. Private Securities Litigation Reform Act of 1995)

    Information provided in this press release may contain statements relating to current expectations, estimates, forecasts and projections about future events that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. These forward-looking statements generally relate to the company’s plans, objectives and expectations for future operations and are based upon management's current estimates and projections of future results or trends. Actual future results may differ materially from those projected as a result of certain risks and uncertainties. For a discussion of such risks and uncertainties, see "Risk Factors" in the Company's Annual Report on Form 20-F filed on June 29, 2007 with the U.S. Securities and Exchange Commission. These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.
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