プレスリリース
SMIC Technology Symposium 2005 Held in Beijing
Beijing, China [2005-08-26]
(Beijing, China, August 26, 2005) Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI and HKSE: 981) held its annual technology symposium in Beijing today, attracting IC designers, customers, technology partners, and equipment vendors from around the world.
At the symposium, SMIC reported that it is currently researching and developing 65nm technologies. In addition, updates were provided on technologies such as 90nm logic, 0.13um low-voltage, low leakage, mixed-signal, 0.18um embedded EEPROM, 0.18um NOR flash, 0.18um high-voltage, LCoS, and CMOS image sensors. Cadence's Senior Vice President, Mr. Jim Miller, presented the keynote speech on "Opportunities for China in the Global Semiconductor Economy". The symposium also featured an exhibition of more than 30 IP, library, EDA, and assembly and testing partners.
A highlight of this year's symposium is a panel discussion on the cooperation between design companies and foundries. Jointly organized by SMIC and IC China, the panel discussion featured chief executive officers from several major Chinese design companies, including, Vimicro, Datang, Haier, ARCA, HED, and BOE. Dr. Sheng Liang, Vice Chairman of the Beijing Semiconductor Industry Association (BSIA) hosted the panel discussion. In addition, several media outlets were invited to the symposium to network with industry leaders.
"SMIC will continue to promote mutual successes for designers and manufacturers through supporting and exploring further collaborations with China's IC design industry," said SMIC CEO and President, Dr. Richard Chang, who was one of the participating panelists.
SMIC further indicated that by the end of the second quarter of this year, its Beijing 12" wafer fabrication facility has reached a monthly capacity of over 16,500 8"-equivalent wafers and SMIC's four 8" fabs in Shanghai and Tianjin have reached a monthly capacity of over 120,000 wafers. SMIC's two joint venture projects in Shanghai and Chengdu are also expected to enter pilot production in the near future.
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 0.11-micron and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing. SMIC also maintains customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. As part of its dedication towards providing high-quality services, SMIC has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000, BS7799 and ISO14001 certifications. For additional information, please visit http://www.3dsentson.com.
(Beijing, China, August 26, 2005) Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI and HKSE: 981) held its annual technology symposium in Beijing today, attracting IC designers, customers, technology partners, and equipment vendors from around the world.
At the symposium, SMIC reported that it is currently researching and developing 65nm technologies. In addition, updates were provided on technologies such as 90nm logic, 0.13um low-voltage, low leakage, mixed-signal, 0.18um embedded EEPROM, 0.18um NOR flash, 0.18um high-voltage, LCoS, and CMOS image sensors. Cadence's Senior Vice President, Mr. Jim Miller, presented the keynote speech on "Opportunities for China in the Global Semiconductor Economy". The symposium also featured an exhibition of more than 30 IP, library, EDA, and assembly and testing partners.
A highlight of this year's symposium is a panel discussion on the cooperation between design companies and foundries. Jointly organized by SMIC and IC China, the panel discussion featured chief executive officers from several major Chinese design companies, including, Vimicro, Datang, Haier, ARCA, HED, and BOE. Dr. Sheng Liang, Vice Chairman of the Beijing Semiconductor Industry Association (BSIA) hosted the panel discussion. In addition, several media outlets were invited to the symposium to network with industry leaders.
"SMIC will continue to promote mutual successes for designers and manufacturers through supporting and exploring further collaborations with China's IC design industry," said SMIC CEO and President, Dr. Richard Chang, who was one of the participating panelists.
SMIC further indicated that by the end of the second quarter of this year, its Beijing 12" wafer fabrication facility has reached a monthly capacity of over 16,500 8"-equivalent wafers and SMIC's four 8" fabs in Shanghai and Tianjin have reached a monthly capacity of over 120,000 wafers. SMIC's two joint venture projects in Shanghai and Chengdu are also expected to enter pilot production in the near future.
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 0.11-micron and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing. SMIC also maintains customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. As part of its dedication towards providing high-quality services, SMIC has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000, BS7799 and ISO14001 certifications. For additional information, please visit http://www.3dsentson.com.
