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SMIC's 28nm Chips Power Mainstream Smartphones Marking a New Era for Advanced Chip Manufacturing in China
SHANGHAI, Aug. 10, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry and one of the world's largest foundries, today announced its 28nm process technology that is used for manufacturing Qualcomm® Snapdragon™ 410 processors, has been successfully adopted into mainstream smartphones. This marks a significant step in the commercial usage of 28nm core chips, and a new era of advanced mobile phone chip manufacturing in China. This is another major breakthrough in the company's collaboration on 28nm, following SMIC's announcement of successfully fabricating Qualcomm Technologies' processors at the end of last year.
Qualcomm Snapdragon 410 processors, with integrated 4G LTE, offer an abundant feature set for high-volume smartphones. Compared with 40nm technologies, processors manufactured on 28nm process technology have twice the logic density, are 20 to 30 percent faster, and consume 30 to 50 percent less power.
Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC said: "The first batch that used SMIC's 28nm node performed well, achieving recognition from Qualcomm Technologies and mobile phone manufacturers. This is an important moment for the industry's entire ecosystem, because for the first time, China's mainland manufacturers can now introduce mainstream smartphones which is a result of the close collaboration between SMIC and Qualcomm Technologies. This marks the start of a new era of 28nm advanced mobile phone chip manufacturing in China. In the future, with the development of 28nm technologies, we are looking forward to providing more advanced processing and extensive technical support to Qualcomm Technologies and other global customers."
Derek Aberle, president of Qualcomm Incorporated said: "The Snapdragon 410 processor, manufactured using SMIC 28nm process technology, is a leading chipset designed for the latest generation of high-volume smartphones and tablets. Achieving commercial usage in mainstream smartphones with these chipsets demonstrates the significant progress made by Qualcomm Technologies and SMIC in our advanced process node and wafer fabrication cooperation."
Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services at 0.35-micron to 28-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a second majority owned 300mm fab under development for advance nodes in Beijing; and 200mm fabs in Tianjin and Shenzhen. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.3dsentson.com.
Safe Harbor Statements
(Under the Private Securities Litigation Reform Act of 1995)
This document contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets and intensive intellectual property litigation in high tech industry.
In addition to the information contained in this document, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 28, 2015, especially in the "Risk Factors" section and such other documents that we may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this document may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this document.
SMIC Contact Information:
English Media
Michael Cheung
Tel: +86-21-3861-0000 x16812
Email: Michael_Cheung@3dsentson.com
Chinese Media
Jane Tang
Tel: +86-21-3861-0000 x10088
Email: Jane_Tang@3dsentson.com
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