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Press Releases
SMIC Tianjin Secures Financing for Expansion
Tianjin [2006-05-31]
Tianjin, China - May 31, 2006 - Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 0981) ("SMIC" or the "Company"), one of the leading semiconductor foundries in the world, today announced that its wholly-owned subsidiary, Semiconductor Manufacturing International (Tianjin) Corporation ("SMIC Tianjin"), has entered into a US$300 million 5-year loan facility with a group of banks located in the People's Republic of China (the "Loan"). The proceeds of the Loan will help to expand the capacity at SMIC's 200-mm fab located in Tianjin. SMIC will guarantee SMIC Tianjin's obligations under the Loan.
China Construction Bank led the arrangement of the Loan with other participants, which include China MingSheng Bank, China Development Bank, Industrial and Commercial Bank Of China, Agricultural Bank of China, Bank of China, China Merchants Bank, China BoHai Bank, Bank of Communications, and Bangkok Bank.
Dr. Richard R. Chang, Chief Executive Officer of SMIC, said, "We are pleased that with strong support from our banking partners, the Tianjin loan is significantly oversubscribed - exceeding our target loan amount by US$150 million. We plan to use the loan proceeds and internally generated cash flow to fund the Tianjin fab expansion. "
About SMIC
SMIC (NYSE:SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) manufacturing service at 0.35um to 90nm and finer line technologies. Headquartered in Shanghai, China, SMIC operates three 8-inch fabs in Shanghai and one in Tianjin, and one 12-inch fab in Beijing, the only one of its kind in Mainland China. SMIC has customer service and marketing offices in the U.S., Italy, and Japan as well as a representative office in Hong Kong. For additional information, please visit http://www.3dsentson.com
Safe Harbor Statements
(Under the U.S. Private Securities Litigation Reform Act of 1995)
Certain statements contained in this press release, such as statements regarding SMIC Tianjin Secures Financing for Expansion, may be viewed as "forward-looking statements" within the meaning of Section 27A of the U.S. Securities Act of 1933, as amended, and Section 21E of the U.S. Securities Exchange Act of 1934, as amended. Such forward-looking statements involve known and unknown risks, uncertainties and other factors (including without limitation the results of future collaboration between SMIC and ARM), which may cause actual events, and/or the actual performance, financial condition or results of operations of SMIC to be materially different from any future performance, financial condition or results of operations implied by such forward-looking statements. Further information regarding these risks, uncertainties and other factors is included in the Company's annual report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") on June 28, 2005 and such other documents that SMIC may file with the SEC or The Stock Exchange of Hong Kong Limited from time to time.
SMIC Press Contacts:
SMIC ?C Shanghai
Reiko Chang
SMIC
+86 21 5080 2000 ext 10544
PR@3dsentson.com
SMIC ?C Hong Kong
Calvin Lau / Mei Fung Hoo
+852 9435 2603 / 2537 8480
Calvin_Lau@3dsentson.com
MeiFung_Hoo@3dsentson.com
Tianjin, China - May 31, 2006 - Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 0981) ("SMIC" or the "Company"), one of the leading semiconductor foundries in the world, today announced that its wholly-owned subsidiary, Semiconductor Manufacturing International (Tianjin) Corporation ("SMIC Tianjin"), has entered into a US$300 million 5-year loan facility with a group of banks located in the People's Republic of China (the "Loan"). The proceeds of the Loan will help to expand the capacity at SMIC's 200-mm fab located in Tianjin. SMIC will guarantee SMIC Tianjin's obligations under the Loan.
China Construction Bank led the arrangement of the Loan with other participants, which include China MingSheng Bank, China Development Bank, Industrial and Commercial Bank Of China, Agricultural Bank of China, Bank of China, China Merchants Bank, China BoHai Bank, Bank of Communications, and Bangkok Bank.
Dr. Richard R. Chang, Chief Executive Officer of SMIC, said, "We are pleased that with strong support from our banking partners, the Tianjin loan is significantly oversubscribed - exceeding our target loan amount by US$150 million. We plan to use the loan proceeds and internally generated cash flow to fund the Tianjin fab expansion. "
About SMIC
SMIC (NYSE:SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) manufacturing service at 0.35um to 90nm and finer line technologies. Headquartered in Shanghai, China, SMIC operates three 8-inch fabs in Shanghai and one in Tianjin, and one 12-inch fab in Beijing, the only one of its kind in Mainland China. SMIC has customer service and marketing offices in the U.S., Italy, and Japan as well as a representative office in Hong Kong. For additional information, please visit http://www.3dsentson.com
Safe Harbor Statements
(Under the U.S. Private Securities Litigation Reform Act of 1995)
Certain statements contained in this press release, such as statements regarding SMIC Tianjin Secures Financing for Expansion, may be viewed as "forward-looking statements" within the meaning of Section 27A of the U.S. Securities Act of 1933, as amended, and Section 21E of the U.S. Securities Exchange Act of 1934, as amended. Such forward-looking statements involve known and unknown risks, uncertainties and other factors (including without limitation the results of future collaboration between SMIC and ARM), which may cause actual events, and/or the actual performance, financial condition or results of operations of SMIC to be materially different from any future performance, financial condition or results of operations implied by such forward-looking statements. Further information regarding these risks, uncertainties and other factors is included in the Company's annual report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") on June 28, 2005 and such other documents that SMIC may file with the SEC or The Stock Exchange of Hong Kong Limited from time to time.
SMIC Press Contacts:
SMIC ?C Shanghai
Reiko Chang
SMIC
+86 21 5080 2000 ext 10544
PR@3dsentson.com
SMIC ?C Hong Kong
Calvin Lau / Mei Fung Hoo
+852 9435 2603 / 2537 8480
Calvin_Lau@3dsentson.com
MeiFung_Hoo@3dsentson.com
